Dynamics-based Nondestructive Structural Health Monitoring Techniques

Award Information
Agency:
Department of Defense
Amount:
$99,850.00
Program:
STTR
Contract:
FA9550-09-C-0105
Solitcitation Year:
2008
Solicitation Number:
2008.A
Branch:
Air Force
Award Year:
2009
Phase:
Phase I
Agency Tracking Number:
F08A-016-0233
Solicitation Topic Code:
AF08-T016
Small Business Information
FBS, Inc.
143 Hawbaker Industrial Drive Suite #102, State College, PA, 16803
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
168596554
Principal Investigator
 Michael Avioli
 Vice President
 (814) 234-3437
 mavioli@fbsworldwide.com
Business Contact
 Michael Avioli
Title: Vice President
Phone: (814) 234-3437
Email: mavioli@fbsworldwide.com
Research Institution
 Penn State University
 David W Richardson
 110 Technology Center Building
Universit y Park, PA, 16802
 (814) 865-1804
 Nonprofit college or university
Abstract
FBS, Inc. and The Pennsylvania State University propose the development of a novel ultrasonic structural health monitoring (SHM)/nondestructive testing (NDT) technology. The goal of our work is to bridge the gap from the short time transient ultrasonic guided wave analysis to the long time modal vibration analysis. This new technique will be sensitive to material properties, defect presence, and overall structural shape. Our hypothesis is that plate loading via comb or annular array loading to achieve optimal wave structures for best sensitivity to a certain defect will also produce different structural reflection characteristics and vibration modes and frequencies. Hence, physically based features from transient, reflection, and modal analysis will be used to characterize defects via pattern recognition analysis. BENEFIT: The resulting technology will enhance SHM/NDT technology by bridging the gap between transient wave ultrasonics and modal analysis. If successful, the proposed technology will increase aviation safety while minimizing inspection times by allowing large area screening of an entire component from only a few sensor positions.

* information listed above is at the time of submission.

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