Device for In-Situ Coating of Long, Small Diameter Tubes

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-09ER85596
Agency Tracking Number: 91324
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: 46 d
Solicitation Number: DE-PS02-08ER08-34
Small Business Information
P.O. Box 5023, Oxnard, CA, 93031
DUNS: 094430089
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Henry Poole
 (805) 981-1784
Business Contact
 Henry Poole
Title: Mr.
Phone: (805) 981-1784
Research Institution
Electron clouds in existing accelerators limit machine performance through dynamical instabilities and/or associated vacuum pressure increases. In addition, wall resistivity in accelerators causes ohmic heating and can lead to resistive wall instabilities. In situ coating of the stainless steel vacuum tubes with Cu and TiN could mitigate both of these problems. Therefore, this project will develop a robotic plasma deposition technique for in situ coating of long, small diameter tubes with copper and titanium nitride, in order to mitigate the problems of electron clouds and wall resistivity. The technique entails fabricating a robotic device comprised of staged magnetrons. In Phase I, an unbalanced magnetron sputtering device, configured for small radial dimensions, will be fabricated and operated to determine copper deposition rates. A planar titanium magnetron for titanium nitride deposition will be designed, and a preliminary design of the Phase II full-scale device will be developed. Commercial Applications and other Benefits as described by the awardee:In addition to mitigating the electron cloud and wall resistivity problems in accelerators, the technology should have applicability to the in situ coating of small diameter tubes and pipes in chemical, pharmaceutical, and other high purity material processing operations, improving product quality and extending the operational life of the process equipment.

* Information listed above is at the time of submission. *

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