Low-cost, Lightweight, Mid-Wave InfraRed (MWIR) Sensors

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-03-C-0299
Agency Tracking Number: N012-0193
Amount: $0.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
4555 Runway St, Simi Valley, CA, 93063
DUNS: 037553609
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 MUREN CHU
 VICE PRESIDENT
 (805) 582-0155
 M.chu@fermionics.com
Business Contact
 Peter Wang
Title: President
Phone: (805) 582-0155
Email: Peterw@fermionics.com
Research Institution
N/A
Abstract
The ultimate goal of this SBIR project is to develop a technology to produce low-cost, lightweight, MidWave InfraRed (MWIR) sensors. In Phase I, the feasibility of producing a thermo-electrically cooled HgCdTe Focal Plane Array camera has beendemonstrated. In Phase II, the first major objective is to perfect the HgCdTe focal plane array and the array production technology; the second is to miniaturize the electronics operating the camera; and the third is to reduce the overall camera productioncost. In the Phase II, Fermionics will conduct a number of experiments to reduce the dark current of diodes in the HgCdTe array, and thus, to improve the array performance. In addition, Fermionics will select a subcontractor(s) to develop the miniaturizedcamera electronics. Finally, prototype cameras will be manufactured. In Phase III, MWIR HgCdTe FPA cameras will be mass-produced for the Navy and for other commercial applications. The manned land/sea/air vehicle, and infantry military market for suchsensors could be in excess of 1000 cameras per year. Additional applications such as spectroscopy, remote sensing, medical imaging, firefighting, police/border patrol, and other government/commercial/scientific applications could have a market of tens ofthousands/year. As the camera costs drop, the market for such devices is lkely to expand rapidly.

* Information listed above is at the time of submission. *

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