Development and Demonstration of an Advanced Composite Interceptor Nosecone for KEI

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$749,841.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
HQ0006-07-C-7353
Award Id:
74604
Agency Tracking Number:
044-0669
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
5 Morin Street, Biddeford, ME, 04005
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
048268890
Principal Investigator:
Paul Martin
Senior Engineer
(207) 282-5911
plmartin@fibermaterialsinc.com
Business Contact:
David Audie
Senior Contracts Administ
(207) 282-5911
govt@fibermaterialsinc.com
Research Institution:
n/a
Abstract
This SBIR effort will develop, design and fabricate an advanced composite Kinetic Energy Interceptor (KEI) nosecone assembly which features a low-mass configuration, non-ablating thermal protection system and low-shock deployment system. This nosecone assembly will be designed to operate in the launch, fly-out and deployment environments representative of the KEI flight trajectory and deployment conditions consisting of dynamic pressure and aerodynamic heating. The Phase II design development effort will address design analyses and component performance considerations for the purpose of developing a successful nosecone design. This follow-on program provides a sequential development approach to achieve both near-term KEI booster flight demonstration needs as well as the need for advanced capability component systems that increase mission assuredness. For the Phase I program, appropriate component technologies were addressed to conceptualize an interceptor nosecone that will operate at high velocity and feature a non-ablating thermal protection system that complies with thermal performance requirements. The Phase II effort will complete the detailed design, specification and component verification of the interceptor nosecone assembly. During the Phase II effort, final assembly design activities, detailed thermal and structural analyses, material/component development activities, and assembly performance verification will be conducted.

* information listed above is at the time of submission.

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