Breakdown Suppression in Accelerating Structures Using Electron Beam Processing

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$100,000.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-05ER84358
Award Id:
72431
Agency Tracking Number:
78542S05-I
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
4431-H Brookfield Corporate Drive, Chantilly, VA, 20151
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
VadimJabotinski
Mr.
(703) 818-9400
vjabotinski@fm-technologies.co
Business Contact:
FrederickMako
Dr.
(703) 818-9400
fmako@erols.com
Research Institute:
n/a
Abstract
78542S Intense, low emittance beams are required for muon colliders, storage rings, and neutrino factory applications. However, vacuum breakdown and high dark currents, which occur on copper and other electrode materials used in accelerating structures, impose limits on the performance. This project will develop in situ electron beam processing of the whole surface inside muon accelerating RF cavities to allow higher operating electric fields without breakdown and with suppressed dark currents. Phase I will develop a prototype design of the in situ electron beam breakdown suppression system and prepare for its integration in the structure of muon accelerators, including the 201MHz cooling channel currently being designed under the Muon Ionization Cooling Experiment. Commercial Applications and Other Benefits as described by the awardee: The technology should be applicable to high-energy physics and vacuum electronics applications. In muon accelerators, it will allow for higher quality beams for muon colliders, storage rings, and neutrino factory applications. The reduced number of accelerating cavities should dramatically reduce accelerator cost. Vacuum electronics applications include X-ray tubes, pulsed power microwave devices, klystrons, magnetrons, traveling wave tubes, vacuum capacitors, relays, and circuit breakers.

* information listed above is at the time of submission.

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