Removal Tools and Process for LO Materials

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$749,999.00
Award Year:
2002
Program:
SBIR
Phase:
Phase II
Contract:
F33615-02-C-5618
Award Id:
52381
Agency Tracking Number:
011ML-1032
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
830 Jury Ct., Suite 5, San Jose, CA, 95112
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
946815826
Principal Investigator:
JamesThomas
VP Engineering
(408) 947-1181
jthomas@lasertronics.com
Business Contact:
MitchellWool
VP Programs
(408) 947-1181
mwool@lasertronics.com
Research Institute:
n/a
Abstract
"General Lasertronics Corporation (GLC), with support from Lockheed Martin Aeronautics, will complete the design, delivery, and evaluation of a laser-based coating removal tool for operational sustainment of Low Observable (LO) materials used on Air Forceweapon systems. The equipment replaces the current removal techniques, which are tedious, labor intensive, and inefficient. Feasibility demonstrations in Phase I confirmed that a pulsed laser operating at 1064 nm with a radiance of 15 to 30 MW/CM2 iseffective in removing pre-specified surface layers of LO material. Feedback electronics are able to control the laser firing circuit so that the removal process automatically terminates when the material substrate becomes exposed. GLC confirmed that highefficiency, diode-pumped laser systems can achieve the necessary radiance for LO coating removal. The demonstration unit was similar to that which the Air Force Safety Office (AF/SES) has stated is explosion safe. In Phase II, GLC will refine thediode-pumped system design to ensure laser safety, waste collection, and user-friendly control features in a compact, small footprint package. GLC will fabricate a prototype and deliver it to the LM Aero F-117 Total System Performance Responsibility(TSPR) for evaluation. LM Aero will support the project and communicate results to the Air Combat Command (ACC) and ASC/YN."

* information listed above is at the time of submission.

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