Microcryocooler for Wafer Scale Integration with Sensors

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$581,000.00
Award Year:
1996
Program:
SBIR
Phase:
Phase II
Contract:
n/a
Award Id:
26187
Agency Tracking Number:
26187
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7662 E. Gray Road, Suite 107, Scottsdale, AZ, 85260
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Woody Ellison
(602) 998-1856
Business Contact:
() -
Research Institute:
n/a
Abstract
CRYOCOOLER MICROELECTROMECHANICAL MICRODYNAMICS INTEGRATED GENERAL PNEUMATICS CORP'S PRELIMINARY DESIGN FOR EMPLOYING MICRODYNAMICS TO PRODUCE MICROELECTROMECHANICAL CLOSED-CYCLE CRYOCOOLERS USING SILICON PROCESSING TECHNIQUES WILL BE USED FOR MAKING INTEGRATED CIRCUITS IN PHASE 1. MICROMINIATURE COOLERS WILL BE INTEGRATED AT THE WAFER SCALE WITH A WIDE VARIETY OF SENSORS AND OTHER COLD ELECTRONIC DEVICES TO MAKE UNITS OF MODEST COST AND HIGH RELIABILITY. DEVELOPMENT OF SELF-CONTAINED MICROCOOLERS FOR DIRECT INTEGRATION WITH AND FABRICATED LIKE WAFER SCALE ELECTRONICS WOULD BE AN ADVANCEMENT COMPARABLE TO THE DEVELOPMENT OF INTEGRATED CIRCUITS. SUCH DEVELOPMENT WOULD FACILITATE THE USE OF COLD ELECTRONICS IN CIVIL, MILITARY, SCIENTIFIC AND MEDICAL APPLICATIONS.

* information listed above is at the time of submission.

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