Microcryocooler for Wafer Scale Integration with Sensors

Award Information
Agency:
Department of Defense
Amount:
$581,000.00
Program:
SBIR
Contract:
N/A
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Missile Defense Agency
Award Year:
1996
Phase:
Phase II
Agency Tracking Number:
26187
Solicitation Topic Code:
N/A
Small Business Information
General Pneumatics Corp
7662 E. Gray Road, Suite 107, Scottsdale, AZ, 85260
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
N/A
Principal Investigator
 Woody Ellison
 (602) 998-1856
Business Contact
Phone: () -
Research Institution
N/A
Abstract
CRYOCOOLER MICROELECTROMECHANICAL MICRODYNAMICS INTEGRATED GENERAL PNEUMATICS CORP'S PRELIMINARY DESIGN FOR EMPLOYING MICRODYNAMICS TO PRODUCE MICROELECTROMECHANICAL CLOSED-CYCLE CRYOCOOLERS USING SILICON PROCESSING TECHNIQUES WILL BE USED FOR MAKING INTEGRATED CIRCUITS IN PHASE 1. MICROMINIATURE COOLERS WILL BE INTEGRATED AT THE WAFER SCALE WITH A WIDE VARIETY OF SENSORS AND OTHER COLD ELECTRONIC DEVICES TO MAKE UNITS OF MODEST COST AND HIGH RELIABILITY. DEVELOPMENT OF SELF-CONTAINED MICROCOOLERS FOR DIRECT INTEGRATION WITH AND FABRICATED LIKE WAFER SCALE ELECTRONICS WOULD BE AN ADVANCEMENT COMPARABLE TO THE DEVELOPMENT OF INTEGRATED CIRCUITS. SUCH DEVELOPMENT WOULD FACILITATE THE USE OF COLD ELECTRONICS IN CIVIL, MILITARY, SCIENTIFIC AND MEDICAL APPLICATIONS.

* information listed above is at the time of submission.

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