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POLYMER MATRIX COMPOSITE HEAT SINKS FOR ELECTRONIC DEVICES
Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 9746
Amount:
$50,000.00
Phase:
Phase I
Program:
SBIR
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Timeline
Solicitation Year:
N/A
Award Year:
1989
Award Start Date (Proposal Award Date):
N/A
Award End Date (Contract End Date):
N/A
Small Business Information
655 S Gravers Rd
Plymouth Meeting, PA
19462
United States
DUNS:
N/A
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Paul W Juneau Jr
Phone: (215) 825-8288
Phone: (215) 825-8288
Business Contact
Phone: () -
Research Institution
N/A
Abstract
METALLIC HEAT SINKS HAVE SERIOUS LIMITATIONS DUE TO HIGH DENSITY AND HIGH COEFFICIENT OF THERMAL EXPANSION CHARACTERISTICS. IT IS PROPOSED TO OVERCOME THESE PROBLEMS BY DEVELOPING COMPOSITE HEAT SINK MATERIALS BASED ON CRYSTALLINE GRAPHITE FIBERS, FILLERS, AND FOAMS HAVING HIGH THERMAL CONDUCTIVITIES, LOW COEFFICIENTS OF EXPANSION, AND LOW DENSITIES. THE RESULTING COMPOSITES BASED ON THESE MATERIALS AND CONVENTIONAL ORGANIC POLYMERS ARE EXPECTED TO COMBINE ADEQUATE THERMAL CONDUCTIVITY CHARACTERISTICS, GOOD MECHANICAL PROPERTIES, AND COEFFICIENTS OF THERMAL EXPANSION MATCHING CERAMIC MICROELECTRONIC COMPONENTS.
* Information listed above is at the time of submission. *
