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Innovative Organic and Inorganic High-Pressure Laminate Insulation for Fusion and Superconducting Magnets

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-01ER83198
Agency Tracking Number: 65493S01-I
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
110 E. Canal Street
Troy, OH 45373
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Karl Graff
 Senior Engineer
 (614) 688-5269
 karl_graff@ewi.org
Business Contact
 Michael Tomsic
Title: President
Phone: (937) 332-0348
Email: tomsic@voyager.net
Research Institution
N/A
Abstract

65493 Future high field (15T+) dipole magnets will require higher performance superconductors, and long lengths will be needed to reduce the cost of these conductors. The A15-type conductors are the most likely superconductors to fulfill this need, but it is very difficult to process the wire without breaks, especially when billet sizes are increased to produce 5-25 km lengths. This processing difficulty is related to the hardness of the multifilamentary composite and the bonding of the filaments. This project will investigate an ultrasonic processing technique to reduce drawing forces and increase bonding between the filaments. Phase I will demonstrate the ultrasonic wire drawing of A15-type superconductors. The benefit of reducing drawing forces and increasing the bonding between filaments of the multifilamentary composite wires will be documented. Both Nb3Sn and Nb3Al wires will be evaluated. Commercial Applications And Other Benefits as described by awardee: Although the largest market should be for accelerator and fusion magnets, high field magnets (above 5 tesla) should also have applicability for MRI, NMR, high gradient magnetic separators, and SMES applications.

* Information listed above is at the time of submission. *

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