Novel Conductive Polymer Skins for Morphing UAVs

Award Information
Agency:
Department of Defense
Amount:
$1,194,430.00
Program:
SBIR
Contract:
FA8650-09-C-5004
Solitcitation Year:
2007
Solicitation Number:
2007.3
Branch:
Air Force
Award Year:
2009
Phase:
Phase II
Agency Tracking Number:
F073-039-1474
Solicitation Topic Code:
AF073-039
Small Business Information
GVD Corporation
45 Spinelli Place, Cambridge, MA, 02138
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
085502958
Principal Investigator
 Erik Handy
 Senior R&D Engineer
 (617) 661-0060
 erik@gvdcorp.com
Business Contact
 Hilton Pryce Lewis
Title: President
Phone: (617) 661-0060
Email: hilton@gvdcorp.com
Research Institution
N/A
Abstract
GVD Corporation proposes to develop electrically-conductive skins for morphing UAVs. These skins make use of GVD’s innovative coating technologies, which impart low electrical resistance to the skins. GVD’s approach to conductive skin manufacture is simple, scalable, and easily inserted into current manufacturing processes. The proposed solution preserves the desired deformability of the skin and enables efficient morphing. Further, the electrical properties of the GVD skin are not adversely impacted by significant in-flight deformation. In Phase II, the most promising Phase I conductive skin fabrication methods will be optimized for prototyping, and skins made using these methods will be incorporated with morphing structures and subjected to rigorous testing in simulated environments. BENEFIT: GVD’s conductive skin fabrication approach is applicable to many types of deformable polymeric materials, which could be tremendously important to the growing morphing air vehicles industry. Specifically, these skins can be used for RF signature reduction, EMI shielding, lightning strike protection, and structural health monitoring, among other Air Force applications. GVD’s conductive coatings technology has numerous commercial applications as well, such as in “smart” fabrics (e.g., for wearable electronics), EMI shielding gaskets, ESD materials, and biomedical implants.

* information listed above is at the time of submission.

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