Low noise longwave infrared (8-12m) focal plane array with high sensitivity for passive hyperspectral standoff detection

Award Information
Agency:
Department of Defense
Branch
Office for Chemical and Biological Defense
Amount:
$69,998.00
Award Year:
2010
Program:
SBIR
Phase:
Phase I
Contract:
W911SR-10-C-0040
Award Id:
96634
Agency Tracking Number:
C101-105-0117
Solicitation Year:
n/a
Solicitation Topic Code:
CBD 10-105
Solicitation Number:
n/a
Small Business Information
181 Stedman St. #2, Lowell, MA, 01851
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
607557795
Principal Investigator:
JarrodVaillancourt
Research Scientist
(978) 430-7128
Jarrod.Vaillancourt@appliednanofemto.com
Business Contact:
JIngChen
President
(978) 761-4293
Jing.chen@appliednanofemto.com
Research Institute:
n/a
Abstract
Longwave infrared (LWIR, 8-12m) focal plane arrays (FPAs) play an important role in hyperspectral chemical and biological sensing. Existing thermal detectors are unable to meet the high sensitivity and fast response requirements of many hyperspectral chemical and biological sensing applications. Photodetectors and FPAs based on photon excited electron generation process can fulfill the speed and sensitivity requirements. However, they show high noise, and thus need to be cooled down to < 80 K to reduce the noise. The requirement for cryogenic cooling systems adds cost, power consumption and reliability issues, thereby making it unsuitable for standoff sensing and detections. This SBIR proposal aims to develop a new low noise highly sensitive LWIR FPA without the need of cryogenic cooling systems. Such FPA technology would significantly reduce the size weight, and power consumption and especially suitable for standoff hyperspectral chemical and biological sensing and detections. In phase I, the proposed FPA will be evaluated and compared existing FPA technologies. A preliminary FPA design will be generated to meet the requirements of standoff hyperspectral imaging systems. In Phase II, a prototype of the LWIR FPA will be developed and packaged with supporting electronics and optics components to produce a hyperspectral IR camera.

* information listed above is at the time of submission.

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