Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$500,000.00
Award Year:
2010
Program:
STTR
Phase:
Phase II
Contract:
HQ0147-10-C-7203
Agency Tracking Number:
B08B-010-0020
Solicitation Year:
n/a
Solicitation Topic Code:
MDA 08T010
Solicitation Number:
n/a
Small Business Information
Applied Nanotech, Inc.
3006 Longhorn Blvd., Suite 107, Austin, TX, 78758
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
013475129
Principal Investigator:
Mohshi Yang
PI/Chief Technical Officer
(512) 339-5020
myang@appliednanotech.net
Business Contact:
Nancy Ruel
Director, Contracts & Program Mgmt.
(512) 339-5020
nruel@appliednanotech.net
Research Institution:
Center for Advanced Lifecycle Eng.
Mike Osterman
Bldg 89, room 1103
University of Maryland
College Park, MD, 20742
(301) 405-5323
Nonprofit college or university
Abstract
Missile Defense Agency is seeking new technologies to reduce the tendency to form tin whiskers in electronic assemblies and microelectronic devices. RoHS regulations enacted by the European Union have generated a global shift toward Pb-free electronic components and circuitry. Pb-free solders create reliability problems in military applications such as aircraft and missiles that are subject to highly stressed environments by exacerbating tin whisker formation. Applied Nanotech, Inc. has developed a novel technique to simultaneously remediate existing tin whiskers and modify the underlying structure to prevent new ones from growing. Following a successful Phase I program, ANI will continue to team with its strategic partners to provide increased validation and optimization of the process for tin whisker mitigation. The Phase II program has been designed to transition the technology into a manufacturable process for commercial integration.

* information listed above is at the time of submission.

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