Nanomaterials for High Performance Thermal Packaging

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$99,999.00
Award Year:
2010
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-10ER85892
Award Id:
99301
Agency Tracking Number:
94349
Solicitation Year:
n/a
Solicitation Topic Code:
06 c
Solicitation Number:
n/a
Small Business Information
3006 Longhorn Blvd. Suite 107, Austin, TX, 78758
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
013475129
Principal Investigator:
James Novak
Dr.
(512) 339-5020
jnovak@appliednanotech.net
Business Contact:
Zvi Yaniv
Dr.
(512) 339-5020
zyaniv@appliednanotech.net
Research Institution:
n/a
Abstract
Modern electrical systems operate with high power consumption and as a result of the power dissipation generate much heat that can damage components and limit application lifetime. Even with the specialty materials currently used in both the electronic package as well as the mounting buss for heat dissipation, most systems still require additional cooling mechanisms. ANI proposes adaptation of a high thermal conductivity carbon aluminum composite and a Cu nanoparticle based solder to generate next generation high thermal capacity electronic packaging which will reduce or eliminate the need for external cooling loops. This new material is expected to show increased performance over traditional direct bonded copper substrates. Commercial Applications and Other Benefits: Successful development of our novel thermal management solution will provide increased options for power electronics and overall thermal management solutions.

* information listed above is at the time of submission.

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