Alternative Methods of Wireless Sensor Power

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,960.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
N65538-06-M-0014
Agency Tracking Number:
N052-130-0459
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
HI-Z TECHNOLOGY, INC.
Suite 7400, 7606 Miramar Road, San Diego, CA, 92126
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
192116440
Principal Investigator:
Velimir Jovanovic
Principal Investigator
(858) 695-6660
v.jovanovic@hi-z.com
Business Contact:
Norbert Elsner
President & CEO
(858) 695-6660
n.elsner@hi-z.com
Research Institution:
n/a
Abstract
Hi-Technology, Inc. (Hi-Z) proposes to use thermoelectric devices in developing an alternate method of providing power for wireless sensors. A thermoelctric gneator (TEG) converts heat directly to electicity in a compact, reliable, robust, solid-state module. Hi-Z has developed thermoelectric module technology that is well suited for this Navy application. Using the experience gained in the current Phase II SBIR where a small power-harvesting TEG is being designed and fabricated for Navy wireless sensors, Hi-Z is planning to examine all potential heat sources and select the best one for the conceptual design of a TEG for this application generating 10-100mW constant power and having a minimum life of 4 years. In the Phase II SBIR, Hi-Z is designing a TEG that utilizes the heat transfer between shipboard waste heat sources and the ambient air to generate electricity for wireless sensor. In two prior Navy applications Hi-Z designed TEGs for senors wih the one installed on USS Monterrey (CG61) operating on just a 5C difference between the temperature of the space inside the ship and the ships hull. In order to satisfy the desired small form factor for the alternate power source, Hi-Z proposes to apply its innovative Quantum Well thermoelectric technology that has four times higher conversion efficiency than SOTA bulk thermoelectrics.

* information listed above is at the time of submission.

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