ADVANCED COMPOSITE SOLDER FOR MICROELECTRONICS

A DISPERSION AND COMPOSITE STRENGTHENING APPROACH INCORPORATING THE BENEFITS OF RAPID SOLIDIFICATION AND IN-SITU COMPOSITE FORMATION IS PROPOSED FOR THE DEVELOPMENT OF CREEP AND FATIGUE RESISTANT HIGH STRENGTH SOLDER ALLOYS AND COMPOSITES FOR ELECTRONICS PACKAGING APPLICATIONS . THE GOAL OF PHASE I OF THE PROGRAM IS TO DEMONSTRATE THE FEASIBILITY OF PRODUCING BY INDUCTION MELTING AND INERT GAS ATOMIZATION DISPERSION STRENGTHENED TIN-LEAD SOLDER ALLOYS AND COMPOSITES WITH SIGNIFICANT IMPROVEMENTS IN ROOM AND ELEVATED TEMPERATURE STRENGTH, CREEP RESISTNACE AND FATIGUE LIFE OVER CONVENTIONAL SOLDERS. TEN LOTS OF SN-PB-X (X = CU, Y, CE, NI, TI, B) BASED ALLOYS WILL BE PRODUCED BY RAPID SOLIDIFICATION PROCESSING, CONSOLIDATED BY HOT ISOSTATIC PRESSING, AND EXTRUDED TO RODS. MICROSTRUCTURES, MECHANICAL PROPERTIES, AND SOLDERABILITY OF THE ALLOYS WILL BE DETERMINED BY OPTICAL METALLOGRAPHY, SCANNING ELECTRON MICROSCOPY TENSION ,CREEP AND FATIGUE TESTING, AND SOLDER REFLOW CHARACTERIZATION. .