Sensed ENergy Transient INterrogation ELement (SENTINEL)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-08-C-0155
Agency Tracking Number: B063-052-0714
Amount: $798,773.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: 2006
Solicitation Topic Code: MDA06-052
Solicitation Number: 2006.3
Small Business Information
10300 N. Cassel Rd., Vandalia, OH, 45377
DUNS: 052862641
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 HERBERT HIRSCH
 Principal Engineer
 (937) 454-9662
 hhirsch@woh.rr.com
Business Contact
 Herbert Hirsch
Title: President
Phone: (937) 454-9662
Email: hhirsch@woh.rr.com
Research Institution
N/A
Abstract
This is a unique, practical solution to the tampering prevention problem, because even if reverse engineers know exactly how it works - they cannot overcome it. SENTINEL checks the electronic power signature that characterizes a volume operating in its environment. Any volume of or individual analog, digital, or RF elements of any system has a unique power signature on the supply voltage line(s), due to the unique combination of components in the system and their individual activation sequences, which combine to form a signature that is unique to the operating environment in which the element functions. We exploit this signature in a simple system which detects the signature, compares it with an expected one stored within it at activation, and then responds to a detected tampering situation with a reaction that prevents reverse engineering. It can be implemented in any volume, at subsystem, board, MCM, module, or chip levels. Phase II will produce (1) proof-of-concept, tested prototypes, (2) performance and exploitation testing and demonstration results, (3) a comprehensive system design to carry forward into Phase III or transition, and (5) specific commercialization and transition plans. Lockheed-Martin, a MDA system supplier, will participate to ensure transition to MDA systems.

* Information listed above is at the time of submission. *

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