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High Performance Computing in Hybrid Time-Domain CEM

Award Information
Agency: Department of Defense
Branch: Army
Contract: DAAD17-02-C-0066
Agency Tracking Number: A012-1332
Amount: $69,994.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
31255 Cedar Valley Drive, Suite 327
Westlake Village, CA 91362
United States
DUNS: 005100560
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Vijaya Shankar
 Vice President
 (818) 865-3713
 vshankar@hypercomp.net
Business Contact
 Vijaya Shankar
Title: Vice President
Phone: (818) 865-3713
Email: vshankar@hypercomp.net
Research Institution
N/A
Abstract

"HyPerComp, Inc., a premiere developer of innovative and highly scalable parallelcomputational environments for time-domain electromagnetics, is teaming withSAIC-DEMACO in proposing to develop and demonstrate under Phase I, a hybridcapability that combines the virtues of TEMPUS, a time-domain CEM environmentfor low- to mid- frequency full wave solutions with the widely used high frequencycode Xpatch, developed by SAIC-DEMACO. Such a hybrid technology will significantlyextend the range of cost-effective and accurate simulations of large-scale problemsin CEM dealing with complex targets with small features such as cracks, cavities,and microstrip patch antennas on their surfaces, as well as modeling targets in thepresence of foliage and ground effects. The time-domain CEM while serving the US defense interests in RCS and ATRapplications, has numerous commercial applications. Some of them are1) patient-specific bioEM studies of hyperthermia treatment of cancer usingmicrowave radiation and study of cellular phone EM effects on humans,2) EMC/EMI studies of high power electronic circuits, and 3) applications towaveguides and weather radars. Also, many of the pre- and postprocessingtechnologies developed for CEM, such as CAD modeling, grid generation, andnumerical algorithms, apply to a number of other disciplines(e.g., CFD and Computational Manufacturing)."

* Information listed above is at the time of submission. *

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