High Performance Computing in Hybrid Time-Domain CEM

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$69,994.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
DAAD17-02-C-0066
Award Id:
57972
Agency Tracking Number:
A012-1332
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
31255 Cedar Valley Drive, Suite 327, Westlake Village, CA, 91362
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
005100560
Principal Investigator:
Vijaya Shankar
Vice President
(818) 865-3713
vshankar@hypercomp.net
Business Contact:
Vijaya Shankar
Vice President
(818) 865-3713
vshankar@hypercomp.net
Research Institution:
n/a
Abstract
"HyPerComp, Inc., a premiere developer of innovative and highly scalable parallelcomputational environments for time-domain electromagnetics, is teaming withSAIC-DEMACO in proposing to develop and demonstrate under Phase I, a hybridcapability that combines the virtues of TEMPUS, a time-domain CEM environmentfor low- to mid- frequency full wave solutions with the widely used high frequencycode Xpatch, developed by SAIC-DEMACO. Such a hybrid technology will significantlyextend the range of cost-effective and accurate simulations of large-scale problemsin CEM dealing with complex targets with small features such as cracks, cavities,and microstrip patch antennas on their surfaces, as well as modeling targets in thepresence of foliage and ground effects. The time-domain CEM while serving the US defense interests in RCS and ATRapplications, has numerous commercial applications. Some of them are1) patient-specific bioEM studies of hyperthermia treatment of cancer usingmicrowave radiation and study of cellular phone EM effects on humans,2) EMC/EMI studies of high power electronic circuits, and 3) applications towaveguides and weather radars. Also, many of the pre- and postprocessingtechnologies developed for CEM, such as CAD modeling, grid generation, andnumerical algorithms, apply to a number of other disciplines(e.g., CFD and Computational Manufacturing)."

* information listed above is at the time of submission.

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