You are here

A Modular Cluster Tool for Semiconductor Failure Analysis

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: HQ072719C0004
Agency Tracking Number: 19-9J0
Amount: $998,278.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: DMEA172-001
Solicitation Number: 17.2
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-09-06
Award End Date (Contract End Date): 2021-09-05
Small Business Information
P.O Box 10520 3500 South Park Drive
Jackson, WY 83002
United States
DUNS: 128363145
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Viola
 Director of Engineering
 (307) 734-0211
Business Contact
 Robert Viola
Phone: (307) 734-0211
Research Institution

Advanced semiconductor devices form the heart of 21st Century technologies. The mission-critical role that these devices play demands exceptional levels of reliability. When a semiconductor device does fail, it is essential that the cause of the failure is identified as quickly as possible, Because of the daunting complexity of an integrated circuit, a significant amount of intricate material removal must be performed before a device’s failure location can be observed directly. However, this material removal is generally performed manually and critical forensic evidence is often destroyed during sample preparation. To address the limitation of current sample preparation techniques, a Modular Cluster Tool (MCT) is proposed. This system mates high precision chip manipulation and advanced non-contact metrology with state-of-the-art material removal tools. The MCT’s modular design allows it to perform a wide range of material removal tasks on a variety of different semiconductor devices. A high level of operational autonomy minimizes human involvement in the sample preparation process.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government