A Modular Cluster Tool for Semiconductor Failure Analysis

Advanced semiconductor devices form the heart of 21st Century technologies. The mission-critical role that these devices play demands exceptional levels of reliability. When a semiconductor device does fail, it is essential that the cause of the failure is identified as quickly as possible, Because of the daunting complexity of an integrated circuit, a significant amount of intricate material removal must be performed before a device’s failure location can be observed directly. However, this material removal is generally performed manually and critical forensic evidence is often destroyed during sample preparation. To address the limitation of current sample preparation techniques, a Modular Cluster Tool (MCT) is proposed. This system mates high precision chip manipulation and advanced non-contact metrology with state-of-the-art material removal tools. The MCT’s modular design allows it to perform a wide range of material removal tasks on a variety of different semiconductor devices. A high level of operational autonomy minimizes human involvement in the sample preparation process.