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A Holographic and Light-field Processor for Extreme Multi-View Displays

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-19-C-0212
Agency Tracking Number: N171-076-1057
Amount: $499,999.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N171-076
Solicitation Number: 17.1
Timeline
Solicitation Year: 2017
Award Year: 2019
Award Start Date (Proposal Award Date): 2019-01-04
Award End Date (Contract End Date): 2020-01-07
Small Business Information
4040 SPENCER ST STE C
TORRANCE, CA 90503
United States
DUNS: 118922413
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert G Batchko
 President
 (650) 906-1064
 rgb@holochip.com
Business Contact
 Dr. Robert Batchko
Phone: (650) 906-1064
Email: rgb@holochip.com
Research Institution
N/A
Abstract

‘Extreme multiview’ lightfield displays (FoLDs) are needed to enhance the warfighter's ability to operate in today’s information filled battlefield, while giving the warfighter the needed information to quickly assess the battlespace thereby making faster, more informed decisions. Many of the critical component technologies of FoLDs (high pixel density microdisplays and holographic element (hogel) arrays) have recently become available in early prototypes, but these technologies are still not practical solutions. Likewise, the inability of today’s graphics rendering technologies to process extreme multiview lightfield images in real-time is a critical hurdle to the deployment of FoLD systems. Using conventional rendering techniques, the number of render passes needed to generate the radiance images is on the order of the number of hogels in the FoLD. This limitation dramatically increases the system complexity, size, weight, power and cost and burden on the display’s software application. To solve the rendering problem, Holochip invented a new paradigm of lightfield processor, i.e., the method by which the lightfield radiance image is computed. To solve the FoLD problem, Holochip developed a novel extreme multiview 3D display based on novel low-cost hogels and the mature SLM technology used in consumer electronics.

* Information listed above is at the time of submission. *

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