Radio Frequency Digital to Analog Converter and Signal Combiner

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15P7T-09-C-S453
Agency Tracking Number: A082-111-1427
Amount: $119,922.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2008
Solicitation Topic Code: A08-111
Solicitation Number: 2008.2
Small Business Information
HYPRES., INC.
175 Clearbrook Road, Elmsford, NY, 10523
DUNS: 103734869
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Deepnarayan Gupta
 VP Research and Development
 (914) 592-1190
 gupta@hypres.com
Business Contact
 Edward Kulinski
Title: VP Finance and Administration
Phone: (914) 592-1190
Email: ekulinski@hypres.com
Research Institution
N/A
Abstract
Modern radio frequency (RF) communication systems require more efficient and flexible use of wider bandwidths at higher carrier frequencies, which can be achieved only by direct digital representation of the RF signal itself. New advances in ultrafast superconductor circuits enable digital-RF technology extending all the way to microwave SATCOM bands (X, Ka, and EHF). Previously, HYPRES built and delivered to US Army CERDEC a superconducting digital-RF X-Band receiver, clocked above 30 GHz, and demonstrated reception of signals from XTAR, DSCS, and WGS satellites. The present project focuses on the development of two critical components of a digital-RF SATCOM: (1) a digital-RF signal combiner, and (2) an RF digital-to-analog converter (RF-DAC). Phase I will focus on the development of practical system architectures that optimize the tradeoffs between circuit complexity and speed, bits and bandwidth, superconductor and semiconductor, cryogenic and uncooled, and digital and analog. The chosen designs will be laid out in the Phase I Option, and fabricated and tested during Phase II. They will then be packaged with other circuit components and integrated with a compact cryocooler to form a complete digital-RF transceiver for SATCOM and other applications.

* information listed above is at the time of submission.

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