Improved Magnetic Shielding for Superconductor Electronics

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,993.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
N00014-08-M-0147
Award Id:
87561
Agency Tracking Number:
N081-060-0712
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
175 Clearbrook Road, Elmsford, NY, 10523
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
103734869
Principal Investigator:
SergeyTolpygo
Director, Fabrication
(914) 592-1190
stolpygo@hypres.com
Business Contact:
EdwardKulinski
VP Finance & Administration
(914) 592-1190
ekulinski@hypres.com
Research Institute:
n/a
Abstract
HYPRES has developed and demonstrated a family of wideband digital-RF receiver systems for applications in satellite and RF communications, signal intelligence and electronic warfare. In the heart of these systems are ultrahigh speed circuits of superconductor digital electronics. For a high fidelity operation, superconductor electronics needs magnetic environment that attenuates magnetic fields associated with Earth, system platform, and low frequency magnetic interference. This proposal focuses on the development of the novel approach to magnetic shielding of electronics - active magnetic cancellation. It is proposed to develop a hybrid magnetic shielding system comprised of a conventional mu-metal shield and a system of active canceling of the residual fields inside the shield. The system will include high-sensitivity magnetic sensors based on superconducting quantum interference filters - devices which can sense the absolute zero of magnetic field - and a feed back system with thin wire coils for active canceling. It is expected to achieve a factor of 100 improvement in the performance of such a magnetic environment in comparison with the existing passive magnetic shielding. When developed the active magnetic shielding system will become an integral part of the cryogenic package of all HYPRES digital-RF systems for DoD and commercial applications.

* information listed above is at the time of submission.

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