MICROCONTAMINATION REDUCTION IN PLASMA PROCESSING THROUGH CHARGE STATE MODIFICATION

Award Information
Agency:
National Science Foundation
Branch:
N/A
Amount:
$64,980.00
Award Year:
1994
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
27472
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Hy-tech Research Corp.
104 Centre Ct, Radford, VA, 24141
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Robert C Hazelton
 (703) 639-4019
Business Contact
Phone: () -
Research Institution
N/A
Abstract
PLASMA PROCESSING HAS MOVED TO THE FOREFRONT OF INTEGRATED CIRCUIT (IC) FABRICATION TECHNOLOGY. CONTAMINANTS CONTINUE TO PLAGUE THE INDUSTRY BEING RESPONSIBLE FOR MORE THAN 50 PERCENT OF THE YIELD LOSSES. THESE PARTICLES ALSO ACT TO LIMIT THE FEATURE DENSITY ON THE IC WAFERS. ADVANCES IN CLEANROOM TECHNOLOGY HAVE RESULTED IN THE PLASMA PROCESSOR BEING THE MAIN SOURCE OF MICROCONTAMINANTS. PARTICLES IN THE DISCHARGE HAVE BEEN OBSERVED TO CONGREGATE IN ELECTROSTATIC TRAPS NEAR THE WAFER. THE PRECIPITATION OF PARTICLES FROM THESE TRAPS IS A MAJOR SOURCE OF CONTAMINATION. RESEARCHERS ARE ACTIVELY CLEANING THE PARTICLE TRAPS BY MODIFYING THE CHARGE ON THE PARTICLES. THIS DISRUPTS THE ELECTROSTATIC TRAP CONFINEMENT ALLOWING THE PARTICLES TO BE REMOVED.

* information listed above is at the time of submission.

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