Multi-Function Power Module Circuit Board
Department of Defense
Agency Tracking Number:
Solicitation Topic Code:
Small Business Information
Iap Research, Inc.
2763 Culver Avenue, Dayton, OH, 45429
Socially and Economically Disadvantaged:
AbstractIn order to take advantage of the advances in solid state device, new power processing unit designs should be done without any recurring engineering cost. We propose to develop a Multi-Function Power Module Circuit Board technology which eliminates recurring engineering cost for new designs and reduces the cost of assembly of power electronic equipment by an order of magnitude. We will deposit 1-5 mm thick copper traces on plastic substrates thus increasing trace conduction capability from <1A (for conventional PC boards) to >100A. This will permit higher power circuits to be assembled in the same ways that signal level boards now are -- automated component placement,wave soldering, and surface mounting. In addition, resistors, small inductors, cooling channels, and power connectors can be fabricated directly on the board integral with the traces. Finally, the proposed technology will eliminate the conductor waste and environmental problems associated with conventional PC board construction.
* information listed above is at the time of submission.