Continuous Dynamic Processing of Ceramic Tiles for Ground Vehicle Protection

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-05-C-0090
Agency Tracking Number: A043-228-2715
Amount: $119,958.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: A04-228
Solicitation Number: 2004.3
Small Business Information
2763 Culver Avenue, Dayton, OH, 45429
DUNS: 053184776
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Bhanumathi Chelluri
 Sr. Research Scientist
 (937) 296-1806
 bhanu@iap.com
Business Contact
 John Barber
Title: President
Phone: (937) 296-1806
Email: johnb@iap.com
Research Institution
N/A
Abstract
Ceramics and ceramic matrix composite are used as advanced armor materials for their lightweight and superior ballistic performance. The silicon carbide (SiC) armor material, processed by hot pressing at temperature >2000 ?C under high pressure for several hours has better ballistic performance compared to material by other processing routes. However, hot pressing is a slow batch process. Currently semi-continuous Pressure Assisted Densification (PAD) method for SiC material is under development for increasing the yield. The PAD process alone cannot meet the near future demand for ballistic grade SiC. Thus there is a need for alternate continuous processing approaches that have potential for high yields. We propose to develop a Dynamic Processing method for SiC material where high green bodies close to full density are produced in sub-millisecond compaction durations that will enable lower sintering temperature-duration cycles. Due to high green density, the special microstructures and grain sizes of the powders will be retained after sintering to yield high ballistic performance. The proposed dynamic processing method that combines fast compaction with a short sintering cycle has the potential to be developed into a continuous processing method to deliver high performance and high yield.

* Information listed above is at the time of submission. *

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