Lightweight Transformer Replacement

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$746,932.00
Award Year:
2007
Program:
SBIR
Phase:
Phase II
Contract:
N00014-07-C-0159
Agency Tracking Number:
O043-EP5-4082
Solicitation Year:
2004
Solicitation Topic Code:
OSD04-EP5
Solicitation Number:
2004.3
Small Business Information
IAP RESEARCH, INC.
2763 Culver Avenue, Dayton, OH, 45429
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
053184776
Principal Investigator
 Antonios Challita
 Principal Research Engine
 (937) 296-1806
 tonyc@iap.com
Business Contact
 John Barber
Title: President
Phone: (937) 296-1806
Email: johnb@iap.com
Research Institution
N/A
Abstract
The overall objective of the Phase I effort was to establish the feasibility of a Solid State Lightweight Transformer (SSLT) Concept to significantly increase power density for 13.8 kV – 2.7 MVA class transformers. This was accomplished by developing a concept for the Solid State Lightweight Transformer (SSLT) System which consists of the following subsystems: 1) Transformer, 2) Switching 3) Thermal Management, and 4) Filtering. The phase I concept has the potential to reduce the size of conventional high power, high voltage transformers by a factor ranging from 3 to 5. . The Phase II technical objectives are as follows: · Create the design a high power, high voltage (2.8 MVA, 13.8 kV –450 V, 3 phase) solid state lightweight transformer (SSLT) utilizing Silicon Carbide (SiC) switches operating at frequency greater than 15 kHz. · Generate validated engineering design data resulting from technology maturation of: 1. Electrical insulation for high power, high voltage transformers and high frequency SiC switches 2. Lightweight transformer cooling and compact solid state switching modules 3. Lightweight transformers fabrication. · Validate ship level SSLT benefits via inclusion in trade offs by ship yards and Navy architects · Create a test bed to validate key performance features and increase credibility. · Develop a product introduction plan.

* information listed above is at the time of submission.

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