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SBIR Phase I: Nanowire Structures for Thermal Management

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0512573
Agency Tracking Number: 0512573
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2005
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
627 Conestoga Blvd, Lancaster, PA, 17602
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Steinbeck
 Dr
 (978) 738-8148
 steinbeck@psicorp.com
Business Contact
 John Steinbeck
Title: Dr
Phone: (717) 871-8971
Email: john.steinbeck@illuminex.biz
Research Institution
N/A
Abstract
This Phase I SBIR project aims to develop manufacturing techniques for passive nanowire arrays to be used in electronics thermal management devices. The project team proposes to develop a heat pipe technology using passive nanowire array structures that are an integral component in the manufacture of low profile, high performance heat pipe/spreader devices. The use of passive nanowire arrays is the enabling innovation for the low profile heat pipe devices. The nanowire arrays allow the height of the heat pipe to be reduced to less than 1 mm (0.040") and to be used where conventional thermal management devices are inadequate. Developing the processes for creating large sheets of nanowire arrays will enable automated equipment to produce large numbers of these devices at low cost while meeting the performance needs of next generation circuits. A strategy will be defined to manufacture large area structures that can then be used in automated assembly equipment for high volume, low cost heat pipe manufacture. Commercially, the thermal management issue has become critical in electronics systems as circuits with 100 million transistors dissipating more than 100 W become commonplace. Development of the proposed technology will enable high power circuits and devices to be inserted into smaller system enclosures, allowing for the continued decreases in overall system size without sacrificing performance. The development of an automated assembly process for heat pipe devices will enable heat pipe cost to be reduced and enter the mainstream electronics market.

* Information listed above is at the time of submission. *

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