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High Performance Low Mass Nanowire Enabled Heatpipe

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX08CC13P
Agency Tracking Number: 074278
Amount: $99,985.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: X11.01
Solicitation Number: N/A
Timeline
Solicitation Year: 2007
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-02-01
Award End Date (Contract End Date): 2008-07-31
Small Business Information
1064 New Holland Avenue, Lancaster, PA, 17601-5606
DUNS: 132498903
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Youssef Habib
 Principal Investigator
 (717) 295-3746
 joe.habib@illuminex.biz
Business Contact
 Youssef Habib
Title: CEO
Phone: (717) 295-3746
Email: joe.habib@illuminex.biz
Research Institution
N/A
Abstract
Illuminex Corporation proposes a NASA Phase I SBIR project to develop high performance, lightweight, low-profile heat pipes with enhanced thermal transfer properties enabled by utilizing copper nanowire arrays as the wick material in the heat pipe. Thermal management is a critical issue for advanced electronic and optical systems as current cooling techniques are being rapidly outpaced by the heat load of new technologies. Superior thermal control technologies are needed both for NASA's science spacecraft components and commercial products such as computers and medical lasers. The incorporation of nano-structured materials in heat pipe manufacturing will allow the development of thermal management devices with increased heat dissipation efficiency and a reduced size and weight profile as compared to currently utilized cooling approaches. Illuminex will develop processes to engineer the nanowire wick directly onto the heat pipe package, and using this approach, it s envisioned that heat pipe systems can be manufactured directly into the housings of devices requiring advanced thermal management. This nanotechnology enabled miniaturization can be further size reduced to near the MEMS level for cooling micro-electronics and sensors. Phase II will lead to full commercialization and manufacturing of high performance, low profile, and lightweight heat pipes.

* Information listed above is at the time of submission. *

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