INNOVATIONS FOR THE ADVANCEMENT OF DIRECT-WRITE CIRCUIT BOARD FABRICATION

Award Information
Agency:
National Science Foundation
Branch:
N/A
Amount:
$49,327.00
Award Year:
1993
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
21726
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Imet Corp.
Box 222, Lincoln Center, MA, 01773
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Joseph Masters
 (617) 259-0536
Business Contact
Phone: () -
Research Institution
N/A
Abstract
INNOVATIONS IN THE MANUFACTURE OF A VERY WIDELY USED ELECTRONIC COMPONENT, THE CIRCUIT BOARD, ARE BEING CONSIDERED. FAST PHOTOGRAPHIC SYSTEMS WHICH WOULD PROMOTE THE USE OF COMPUTER-CONTROLLED DIRECT WRITE LASER TECHNIQUES ARE BEING INTRODUCED. CONVENTIONAL FABRICATION INVOLVES CONTACT PRINTING OF A MASK PATTERN ONTO THE CIRCUIT BOARD PHOTORESIST. THE PROCESS OFFERS MASS PRODUCTION, HIGH THROUGHPUT BUT SIGNIFICANT LIMITATION SIN FELXIBILITY; ESPECIALLY FOR SMALL BATCH OR PROTOTYPE RUNS. HOWEVER, UTILIZATION OF MASK-FREE DIRECT-WRITING ON PHOTORESIST REMAINS HELD BACK BECAUSE HIGH THROUGHPUT SEPCIFICATIONS OVERBURDEN EXISTING DIRECT-WRITE SYSTEMS. RESEARCHERS ARE DEVELOPING TWO INNOVATIONS FOR INCREASING DIRECT-WRITE THROUGHPUT BY EFFECTIVELY INCREASING BOTH PHOTORESIST SPEED AND SPECTRAL RANGE, THUS UTILIZING LASERS IN THE 500-700 NM RANGE, HERETOFORE NOT CONSIDERED AS DIRECT-WRITE EXPOSURE SOURCES. A TWO-LAYER RESIST CONCEPT COMPRISING A SILVER PHOTOGRAPHIC COATING OVER A PHOTOPOLYMER SUBLAYER IS BEING EXPLOITED. A FAST, SILVER-BASED PHOTOSENSITIVE CIRCUIT BOARD LAMINATE THAT PROCESSES TO A CONDUCTING WIRING BOARD PATTERN, AVOIDING THE PHOTORESIST STEP IS EMPLOYED.

* information listed above is at the time of submission.

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