SBIR Phase I: Low Dielectric Fiber for High Frequency Circuit Board Applications

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0712117
Agency Tracking Number: 0712117
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solitcitation Year: 2006
Solitcitation Topic Code: EO
Solitcitation Number: NSF 06-598
Small Business Information
Innegrity LLC
2131 Woodruff Rd., Ste 2100-162, Greenville, SC, 29607
Duns: 156390218
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Brian Morin
 PhD
 (864) 908-4763
 brian.morin@innegrity.com
Business Contact
 Brian Morin
Title: PhD
Phone: (864) 908-4763
Email: brian.morin@innegrity.com
Research Institution
N/A
Abstract
The Small Business Innovation Research (SBIR) Phase I project will assess the feasibility of using blends of polymers to make high strength, low dielectric fibers to be used as reinforcements with glass fiber in high frequency circuit board substrate materials. The innovation will allow a reduction in the dielectric constant of 42% (from 5.2 to 3.0) and dielectric loss of 80% (from 0.025 to 0.005) in high frequency circuit board substrates when compared to FR-4 circuit board materials. In addition, the density of the board materials will be decreased by 35%, lowering the weight in mobile and transportation applications. While blends of polymer materials are common, those chosen for the proposed research are particularly interesting not only for the proposed application, but also for the technical challenges inherent in the chosen strategy. Specifically, the research proposes to blend miscible polymers, one of which is amorphous and the other semi-crystalline. While the processing temperature ranges overlap, the high shear environment of fiber spinning should provide for interesting science as well as a strong commercial need. If successful, the fibers will provide for a low cost, light weight reinforcement which can provide significant benefit to high frequency circuit board materials in applications ranging from high speed computing to mobile communications.

* information listed above is at the time of submission.

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