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Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA220C0005
Agency Tracking Number: T2-0358
Amount: $999,688.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: DTRA172-003
Solicitation Number: 17.2
Solicitation Year: 2017
Award Year: 2020
Award Start Date (Proposal Award Date): 2020-01-15
Award End Date (Contract End Date): 2022-01-14
Small Business Information
P.O. Box 422
Trumansburg, NY 14886
United States
DUNS: 101321479
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Judson Powers
 Technical Director
 (607) 257-1975
Business Contact
 Richard Smith
Phone: (607) 257-1975
Research Institution

Next-generation high-performance computing (HPC) hardware, such as the Intel Xeon Phi Knights Landing Many-Integrated-Core processor, provide new deep memory architectures that offer the promise of increased performance. The challenge in taking full advantage of this architecture is selecting which data structures will be placed in the high-bandwidth memory. Optimizing data structure placement in memory is a task that requires the assistance of automated tools. To address this need, ATC-NY is developing the Memory Instrumentation and Performance Simulation (MIPS) software, a memory analysis and optimization tool aimed at next-generation HPC memory architectures. MIPS directly instruments as-built optimized binaries (without requiring source code or modification of the software build process) models the behavior of the complete memory hierarchy of a system, and uses this analysis to produce intelligent, actionable advice on memory placement. MIPS also provides the cutting-edge capability to apply memory placement optimization without requiring source code changes, enabling a single software executable to be used on differently-configured systems and for different use cases without requiring software re-engineering and without giving up any potential performance.

* Information listed above is at the time of submission. *

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