Optical Fiber-Based Hypergolic Chemical Leak Detector for Shipboard Applications in Multiple Required Sensing Locations

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$749,999.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
W9113M-06-C-0153
Award Id:
69657
Agency Tracking Number:
B041-052-0748
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
2531 West 237th Street Suite 127, Torrance, CA, 90505
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
114060861
Principal Investigator:
Kisholoy Goswami
Director of Research
(310) 530-2011
kisholoy.goswami@innosense.us
Business Contact:
Latika Datta
Chief Operating Officer
(310) 530-2011
latika.datta@innosense.us
Research Institute:
n/a
Abstract
In collaboration with Northrop Grumman Corporation, this project will develop an optical fiber-based automated hypergolic leak detection network to gain Navy's approval for sea-basing the KEI System. Building on the Phase I successes, indicators for optically sensing monomethylhydrazine (MMH) and nitrogen tetroxide (NTO) would be packaged as a thin film for deployment within the kill vehicle (KV). Battery replacement or servicing will not be needed once the sensor is installed inside the KV. A plurality of sensors would be networked for monitoring multiple required locations. During Phase II, the prototype would be engineered and its performances would be characterized to ensure compliance with KEI requirements with respect to parameters such as size, weight, sensitivity, response time, lack of false alarm, cross-sensitivity, temperature and humidity range, accuracy, reproducibility, measurement precision, operational life, and compatibility with the shipboard Command and Control System. At the end of Phase II, InnoSense LLC will deliver the prototype with a form factor compatible with the KEI Program for detecting the vapors of MMH and NTO at or below limits set by the regulatory agencies. Strategic partnership has been arranged for Phase III follow-on funding, and for manufacturing the sensor system in Phase III.

* information listed above is at the time of submission.

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