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Thermal History of Ordnance - A Colorimetric Aid during Storage and Transit

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-09-C-0153
Agency Tracking Number: A082-053-0960
Amount: $1,374,130.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A08-053
Solicitation Number: 2008.2
Timeline
Solicitation Year: 2008
Award Year: 2009
Award Start Date (Proposal Award Date): 2009-09-25
Award End Date (Contract End Date): 2013-03-31
Small Business Information
2531 West 237th Street Suite 127
Torrance, CA 90505
United States
DUNS: 114060861
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Uma Sampathkumaran
 Director of Research
 (310) 530-2011
 uma.sampathkumaran-1@innosense.us
Business Contact
 Kisholoy Goswami
Title: President and CEO
Phone: (310) 530-2011
Email: kisholoy.goswami@innosense.us
Research Institution
N/A
Abstract

The Army requires a time-temperature device to record and visually evaluate the environmental exposure history of ordnance during their lifecycle. In Phase I, InnoSense LLC (ISL) evaluated several material formulations and selected two for integration into a working model. They are colorimetric, reversible and irreversible temperature indicators that respond to temperatures from 100 to 200 °F. During Phase II, ISL will develop and test the prototype device with scale up in mind and deliver multiple sets of the prototype to the Army. Phase III engineering of the device will offer benefits that include: (1) reduced procurement cost, (2) long-term operational life and reliable performance at temperature extremes of Army relevance, (3) materials that visibly indicate current and past history of temperature events, (4) ease of application and adhesion to metallic or plastic surfaces, (5) UV light tolerance, and (6) application specific device footprint. Phase II work plan and Phase III goals have been outlined to expedite transitioning this technology into DOD’s procurement system. ISL has received strong letters of technology interest from potential partners within the DOD community.

* Information listed above is at the time of submission. *

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