SSVD Extreme Temperature Electronics for Planned Venus Missions

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$70,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
NNG04CA86C
Agency Tracking Number:
034779
Solicitation Year:
2003
Solicitation Topic Code:
S4.02
Solicitation Number:
n/a
Small Business Information
InnoSys, Inc.
3622 West 1820 South, Salt Lake City, UT, 84104-4901
Hubzone Owned:
N
Socially and Economically Disadvantaged:
Y
Woman Owned:
Y
Duns:
013017947
Principal Investigator:
Larry Sadwick
Principal Investigator
(801) 975-7399
sadwick@innosystech.com
Business Contact:
R. Jennifer R. Jennifer Hwu
CEO/President
(801) 975-7399
hwu@innosystech.com
Research Institution:
n/a
Abstract
The purpose of this project is to demonstrate, based on a new class of electronic devices called solid state vacuum devices (SSVD?s), a highly promising enabling technology for extreme high temperature radiation hard electronics. SSVD?s marry solid state semiconductor technology, including the process fabrication techniques, with vacuum electronics, and, in this case, specifically thermionic vacuum electronics. SSVD?s have already been demonstrated for highly demanding high frequency applications. Thermionic SSVD?s, in which vacuum transport is by thermionically emitted electrons, are especially promising due to their intrinsic internal high temperature operation and radiation hardness. SSVD?s should be extremely well suited for extreme environments that, for example, exist on or near Venus. Currently no existing electronics can address this extreme environment. InnoSys proposes to demonstrate thermionic SSVD? triodes/field effect transistors and the associated assembly and sealing to meet the requirements needed for extreme high temperature electronics. In particular, to demonstrate this capability, 460oC electronics for low noise (less than 10 nanovolt/square root(Hz)) and 0 to 100 volt or higher output circuitry and appropriate innovative temperature and pressure assemblies and sealing techniques needed for reliable and sustained operation of SSVD? devices for NASA robotic, sensor and actuators applications will be studied.

* information listed above is at the time of submission.

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