High-Efficiency Extremely High-Frequency (EHF) Power Amplifiers

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8718-06-C-0059
Agency Tracking Number: F061-206-2301
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2006
Solicitation Topic Code: AF06-206
Solicitation Number: 2006.1
Small Business Information
3622 West 1820 South, Salt Lake City, UT, 84104
DUNS: 013017947
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Larry Sadwick
 CTO
 (801) 975-7399
 sadwick@innosystech.com
Business Contact
 Jennifer Hwu
Title: CEO/President
Phone: (801) 975-7399
Email: hwu@innosystech.com
Research Institution
N/A
Abstract
InnoSys intends to demonstrate improved performance EHF power amplifiers using 3-D microfabrication techniques and technologies that are rugged and can be produced in large quantities at low cost. Per the specifications of this SBIR solicitation, the power output of these 3-D power amplifiers will be > 1.2 watts with an input power of 300 milliwatts, a power-added efficiency greater than 15 percent, and a linearity sufficient to support Gaussian minimum shift keying (GMSK), quadrature phase shift keying (QPSK), 8-phase shift keying (PSK), 16-quadrature amplitude modulation (QAM), filtered symmetric differential phase-shift keying (FSDPSK), differential QPSK (DQPSK), and 8- differential PSK (DPSK) modulation modes over an operating temperature range from -40 to +80 ¢XC. Radiation goals of a total dose of 300 K rad (Si) and single event latchup immunity greater than 90 MeV/mg/cm2 will be met. In addition gains of up to 25 dB, which is significantly greater than the minimum gain specified, can be designed and implemented with the 3-D microstructure approach to be used in this SBIR program. The 3-D microfabrication and 3-D microstructures approach to be developed and used in this SBIR program is applicable to power amplifiers from below 20 GHz to over 80 GHz.

* Information listed above is at the time of submission. *

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