Electronics Reliability Analysis Expert System

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8501-09-P-0275
Agency Tracking Number: O083-M02-1004
Amount: $99,898.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: OSD08-M02
Solicitation Number: 2008.3
Small Business Information
5110 Roanoke Place, Suite 101, College Park, MD, 20740
DUNS: 181660775
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Esser
 Senior Member of Technical Staff
 (301) 474-0607
Business Contact
 Craig Hillman
Title: CEO and Managing Partner
Phone: (301) 474-0607
Email: chillman@dfrsolutions.com
Research Institution
The PoF-based software outlined in this proposal addresses the existing and future challenges of reliably incorporating COTS technology into military applications. The most common process for assessing reliability of military designs with COTS parts is MTBF calculations. The use of MTBF calculations is becoming increasingly inaccurate due to the need for large amounts of empirical data. The recent adoption of Pb-free solders in commercial industry poses an additional risk for electronics reliability assessment. The continuing reduction in size of electronic circuits introduces new problems associated with wearout. These three challenges (MTBF, Pb-free, IC Wearout) speak to the immediate need for a better approach. DfR Solutions proposes an open architecture reliability analysis expert system to address the shortfalls of the current method of predicting reliability in electronic modules. The expert system will be a software application built on Physics of Failure (PoF) principles and will be predictive for new military and COTS technologies. The software will allow easy input of electronic design information. The output will provide the user with a failure rate as a function of time for the assembly. Completion of this project will result in significant benefits to the DoD and the high reliability electronics industry.

* Information listed above is at the time of submission. *

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