Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information
Agency:
Department of Defense
Amount:
$99,643.00
Program:
SBIR
Contract:
N68335-09-C-0169
Solitcitation Year:
2008
Solicitation Number:
2008.3
Branch:
Navy
Award Year:
2009
Phase:
Phase I
Agency Tracking Number:
O083-M01-4013
Solicitation Topic Code:
OSD08-M01
Small Business Information
DfR Solutions
5110 Roanoke Place, Suite 101, College Park, MD, 20740
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
181660775
Principal Investigator
 John McNulty
 Director of East Asian Business Dev
 (415) 806-7704
 jmcnulty@dfrsolutions.com
Business Contact
 Craig Hillman
Title: CEO and Managing Partner
Phone: (301) 474-0607
Email: chillman@dfrsolutions.com
Research Institution
N/A
Abstract
Ball grid array (BGA) commercial off the shelf (COTS) parts with SnPb solder balls are becoming obsolete. The uncertainty of Pb-free solder reliability in severe environments has led to a significant upsurge in reballing within the DoD supply chain. How

* information listed above is at the time of submission.

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