Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-09-C-0169
Agency Tracking Number: O083-M01-4013
Amount: $99,643.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: OSD08-M01
Solicitation Number: 2008.3
Small Business Information
DfR Solutions
5110 Roanoke Place, Suite 101, College Park, MD, 20740
DUNS: 181660775
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John McNulty
 Director of East Asian Business Dev
 (415) 806-7704
 jmcnulty@dfrsolutions.com
Business Contact
 Craig Hillman
Title: CEO and Managing Partner
Phone: (301) 474-0607
Email: chillman@dfrsolutions.com
Research Institution
N/A
Abstract
Ball grid array (BGA) commercial off the shelf (COTS) parts with SnPb solder balls are becoming obsolete. The uncertainty of Pb-free solder reliability in severe environments has led to a significant upsurge in reballing within the DoD supply chain. How

* information listed above is at the time of submission.

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