Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information
Agency:
Department of Defense
Branch
Office of the Secretary of Defense
Amount:
$99,643.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
N68335-09-C-0169
Award Id:
91337
Agency Tracking Number:
O083-M01-4013
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
5110 Roanoke Place, Suite 101, College Park, MD, 20740
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
181660775
Principal Investigator:
JohnMcNulty
Director of East Asian Business Dev
(415) 806-7704
jmcnulty@dfrsolutions.com
Business Contact:
CraigHillman
CEO and Managing Partner
(301) 474-0607
chillman@dfrsolutions.com
Research Institute:
n/a
Abstract
Ball grid array (BGA) commercial off the shelf (COTS) parts with SnPb solder balls are becoming obsolete. The uncertainty of Pb-free solder reliability in severe environments has led to a significant upsurge in reballing within the DoD supply chain. How

* information listed above is at the time of submission.

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