GoofyFoot Labs

Company Information
Address TX
Plano, TX, 75093-4539

http://www.goofyfootlabs.com

Information

DUNS: 828058508

# of Employees: 2


Ownership Information

HUBZone Owned: N

Socially and Economically Disadvantaged: Y

Woman Owned: Y



Award Charts




Award Listing

  1. High Performance/Throughput, Low Latency and Low Power Field Programmable Gate Array (FPGA) for Software Defined Radio (SDR) and Cognitive Radio (CR)

    Amount: $999,048.00

    FPGAs are widely used in nearly every DoD electronics system because of their processing capabilities, low NRE costs, field programmability, and time to market advantages over ASICs. However, FPGAs&qu ...

    SBIRPhase II2013Department of Defense Army
  2. Extreme Environment, Rad Hard, High Performance, Low Power FPGA for Space Applications

    Amount: $125,000.00

    To enable NASA's next-generation missions, there is a critical need for a reconfigurable FPGA that can withstand the wide temperatures ranges and radiation of the space environment while consumin ...

    SBIRPhase I2013National Aeronautics and Space Administration
  3. High Performance/Throughput, Low Latency and Low Power Field Programmable Gate Array (FPGA) for Software Defined Radio (SDR) and Cognitive Radio (CR)

    Amount: $99,995.00

    FPGAs have become one of the most popular implementation media for digital circuits on account of their low NRE costs, field programmability, and time to market advantages over ASICs. However, FPGAs& ...

    SBIRPhase I2011Department of Defense Army
  4. Design and Fabrication Techniques for 3-Dimensional Integrated Circuits

    Amount: $750,000.00

    The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applicat ...

    SBIRPhase II2010Department of Defense Defense Advanced Research Projects Agency
  5. Design and Fabrication Techniques for 3-Dimensional Integrated Circuits

    Amount: $99,000.00

    The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applicat ...

    SBIRPhase I2009Defense Advanced Research Projects Agency Department of Defense

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