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Inkjet-Printed GRIN Microlenses on CMOS Imager Wafers for Synthetic Apertures

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-20-P-0029
Agency Tracking Number: A192-115-0582
Amount: $111,499.71
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A19-115
Solicitation Number: 19.2
Solicitation Year: 2019
Award Year: 2020
Award Start Date (Proposal Award Date): 2019-10-25
Award End Date (Contract End Date): 2020-12-01
Small Business Information
15985 NW Schendel Avenue Suite 200
Beaverton, OR 97006
United States
DUNS: 124348652
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Charles Dupuy
 Senior Scientist
 (971) 223-5646
Business Contact
 Debra Ozuna
Phone: (971) 223-5646
Research Institution

After defining the application requirements, light-field modeling and simulation tools will be used to develop candidate compact synthetic apertures sensor designs, enabled by CMOS imagers with integrated microlenses. Additive manufacturing will be used to fabricate a series of microlens arrays, that vary in shape (e.g., round, square, hexagonal), pitch (e.g., 0.25-mm, 0.5-mm, 1-mm, etc.) and format (2x2, 4x4, 10x10, 40x40, 240x240, etc.) on glass and silicon substrates. Uniform, anamorphic, and chirped microlens arrays will be fabricated and characterized. Two types of microlenses will be additive-manufactured: 1) homogeneous-composition spherical microlenses; and 2) freeform gradient-index microlenses. The ability to planarize CMOS image sensor wafers and to fabricate highly planar tuned-index spacer layers will also be demonstrated. A working functional imager will be demonstrated that integrates the custom lenslet arrays. In Phase II, the process will be optimized and printed sub-aperture image sensors will be designed that are optimized for configuration in a compact synthetic aperture array. A prototype synthetic aperture imaging system will be fabricated and demonstrated using commercial software.

* Information listed above is at the time of submission. *

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