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Advanced Photonic Integrated Circuits for Quantum Key Distribution Transmitters

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8750-20-P-1717
Agency Tracking Number: F20A-T004-0036
Amount: $149,956.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AF20A-T004
Solicitation Number: 20.A
Solicitation Year: 2020
Award Year: 2020
Award Start Date (Proposal Award Date): 2020-06-16
Award End Date (Contract End Date): 2020-11-16
Small Business Information
41 Aero Camino
Goleta, CA 93117-3104
United States
DUNS: 191741292
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Gordon Morrison
 (805) 967-4900
Business Contact
 Milan Mashanovitch
Phone: (805) 967-4900
Research Institution
 University of California
 Johnathan Klamkin
Elings Hall, Mesa Rd
Santa Barbara, CA 93106-6105
United States

 (805) 893-7163
 Nonprofit College or University

Quantum technology advances are currently at the forefront of U.S. military interest. In particular, recent developments in quantum communications have successfully demonstrated quantum key distribution (QKD) in space by the Chinese Micius satellite for quantum studies and quantum communication. Freedom Photonics is exploring photonic integrated circuit (PIC) solutions for time-bin QKD satellite applications.  The PICs that will be developed here will allow the low-CSWAP implementation of QKD transmitters in a satellite constellation necessary for global encryption services. Photonic QKD devices currently have stringent system level requirements that are still being explored. Freedom Photonics LLC and our RI team member are partnering to combine high-performance photonic technology for quantum key distribution (QKD) links. The focus of Phase I will be design of the monolithic QKD transmitter. Freedom Photonics is a vertically-integrated manufacturer of photonic components, modules and systems. We are a U.S. based, ITAR registered, high-performance component and system business, and have full capability in all aspects of design, development, and manufacturing of the core photonics, rugged packaging and electronic hardware and software needed for this program.

* Information listed above is at the time of submission. *

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