Innovative Approaches to Low Power, Sub-Threshold Electronic Circuits

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-09-C-0167
Agency Tracking Number: 08SB2-0729
Amount: $98,952.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: SB082-045
Solicitation Number: 2008.2
Small Business Information
2500 Maitland Center Parkway, Suite 203, Maitland, FL, 32751
DUNS: 791134542
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Filion
 Senior Technical Staff
 (407) 660-9900
Business Contact
 Ryan Jorgenson
Title: VP of Engineering
Phone: (407) 660-9900
Research Institution
This program will develop a revolutionary, ultra low power System-on-a-Chip (SoC) technology that will enable >10x improvements in size and endurance over current generation microsystems such as unattended ground sensing (UGS) systems, micro-UAVs, micro satellites, body worn electronics, etc. This will be achieved through the integration of advanced energy efficient circuit designs that enable the power consumption of the chip to be dynamically matched to the performance needs of the systems. While the technical approaches to intelligent, adaptive, ultra-low power architectures will be generic and broadly applicable to DoD systems specific hardware implementations will be delivered as proof-of-principle prototypes. These will be based on the digital processing “brain” of a microbolometer IR camera system, which is used in all of the above microsystem applications. The focus of this program is on the digital processing of the architecture. The goal is to synergistically integrate into an SoC the low power enabling capabilities of: · Subthreshold transistor operation. · Clockless self timed logic circuits. · Dynamically controlled power supply voltages determined by the data rate. Codetronix will support Camgian in this effort with their Mobius design specification and implementation tool.

* Information listed above is at the time of submission. *

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