Basic Information

101 Clematis Avenue, Unit #1
Waltham, MA, 02453-7012

Point of Contact Information

Field Value
Business Official:
Firm CFO (or equivalent):
POC Contracting Officer (or equivalent)

Additional Details

Field Value
SBC Control ID: SBC_000000854
DUNS: 809965130
SIC Codes: n/a
NAICS Codes: n/a

Company Profile


  1. New Radar/EW Transmit/Receiver Modules and Assemblies Technologies

    Amount: $79,936.00

    This proposal addresses an opportunity for the Navy to establish an integrated business and technical strategy to provide an Open Systems active array technology for emerging Naval radar and EW system ...

    SBIR Phase I 2013 Department of Defense
  2. High Performance, Low-Cost IGBT Power Module Thermal Management for HEV/EV Applications

    Amount: $149,964.00

    This proposal addresses a critical need to develop low cost packaging solutions to reduce size, weight, and increase performance in hybrid electric vehicle (HEV) and electric vehicle (EV) motor drive ...

    SBIR Phase I 2012 Department of Energy
  3. Thin Copper-Graphite Composite Cold Plate and High Performance Al/Gr Composites for Thermal Management of High Density Electronics

    Amount: $157,800.00

    Two approaches to high performance base plates for advanced thermal management applications are proposed. Inexpensive high performance Al/Gr composites have been developed with a quasi-isotropic therm ...

    SBIR Phase II 2012 Department of Defense
  4. Development of Ultra High Performance Thermal Management Technology for High Power Solid State Lasers for MDA Directed Energy Systems

    Amount: $99,999.00

    High efficiency heat-sinks for thermal management of high energy solid state lasers are proposed. Advanced heat sink technology enables increased performance of directed energy solid state lasers. E ...

    SBIR Phase I 2011 Department of Defense
  5. Copper Graphite Composite Passive Thermal Control for High Density Interconnect PCB's

    Amount: $999,979.00

    Thermal management, CTE control, and mechanical stability are critical for lightweight aerospace/defense printed circuit board (PCB) applications. Current materials for PCB"s such as copper and g ...

    SBIR Phase II 2011 NavyDepartment of Defense
  6. High Thermal Conductivity Graphite Reinforced Al Composites for Thermally Stable Structural Panels and Frame with Passive Thermal Control Features for

    Amount: $99,999.00

    Pressure infiltration cast graphite fiber and platelet reinforced Al materials are proposed. Structural materials that have high stiffness, low thermal expansion, very high thermal conductivity and l ...

    SBIR Phase I 2010 Air ForceDepartment of Defense
  7. Ultra-High Thermal Conductivity, Thermal Expansion Matched, Low Density Materials for Dimensionally Stable Space Structures

    Amount: $749,742.00

    High stiffness structural composite skins with high thermal conductivity thermal cores (>800 W/mK) for mounting satellite sensors and electronics were demonstrated. Further hybridization with 800 ...

    SBIR Phase II 2010 Department of Defense
  8. Enhanced Electrical and Thermal Conductivity of Wires Drawn from Cast Cu/Nanophase Composites

    Amount: $69,998.00

    Multi walled carbon nanotubes MWNTs will be coated to enable wetting by molten OFHC copper. Coated MWNTs will be made into a preform and pressure infiltration cast with molten Cu to form a Cu/MWNT mas ...

    SBIR Phase I 2010 NavyDepartment of Defense
  9. Lightweight, CTE Matched Copper Graphite Composite Cores For Enhanced PCB Thermal Management

    Amount: $69,999.00

    Thermal Management, CTE control, and mechanical stability are critical for lightweight aerospace/defense printed circuit board (PCB) applications. Current materials for PCBs do not adequately address ...

    SBIR Phase I 2010 NavyDepartment of Defense
  10. SBIR Phase I: Low Cost Natural Graphite Reinforced Copper (Cu-Grp) Composites for Ultra High Thermal Conductivity Electronic Thermal Management Heat Sinks

    Amount: $99,997.00

    This Small Business Innovative Research Phase I project is to develop extremely high thermal conductivity heat sinks that are thermal expansion matched to advanced semiconductors for high performance ...

    SBIR Phase I 2009 National Science Foundation

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