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Novel Honeycomb Hollow Carbon Fiber Composite

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8649-21-P-0049
Agency Tracking Number: FX20D-TCSO1-0059
Amount: $149,986.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AFX20D-TCSO1
Solicitation Number: X20.D
Solicitation Year: 2020
Award Year: 2021
Award Start Date (Proposal Award Date): 2020-11-20
Award End Date (Contract End Date): 2021-05-20
Small Business Information
1515 West 2200 South Suite F
Salt Lake City, UT 84119-1441
United States
DUNS: 829431076
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Mukund Karanjikar
 (801) 953-1047
Business Contact
 Mukund Karanjikar
Phone: (801) 953-1047
Research Institution
 Georgia Tech Applied Research Corporation
 Scott Niles
926 Dalney St NW
Atlanta, GA 30332-0415
United States

 (404) 385-2080
 Domestic Nonprofit Research Organization

The current commercial polyacrylonitrile (PAN) based carbon fibers such as IM7 and T300 are limited in modulus at 155 and 130 N/tex respectively. In addition, these fibers are high density (1.75 – 1.93 g/cc) and are known to exhibit buckling behavior under compression stress. If these shortcomings are overcome, a number of new applications within DOD as well as civilian markets can be enabled.  Technology Holding LLC (THL) in partnership with Georgia Institute of Technology (GT) proposes to develop a composite based on novel honeycomb hollow carbon fiber (HHCF). The prior work constituted developing the overall method to produce HHCF with a density of 0.9-1.2 g/cc and measured modulus of 209 N/tex, which is 60% higher than T300 without reducing the strength. In addition, a composite coupon with epoxy 977-3 has been fabricated. The phase I feasibility study will focus on two specific objectives; 1. Validate the product-market fit for DOD as well as additional civilian applications and 2. Perform detailed characterization of the coupon to arrive at a set of properties suitable for the prospective product-market fit. 

* Information listed above is at the time of submission. *

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