3D Microfabricated Low Loss Reconfigurable Components

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$88,370.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
NNX09CD83P
Agency Tracking Number:
085557
Solicitation Year:
2008
Solicitation Topic Code:
O1.07
Solicitation Number:
n/a
Small Business Information
Nuvotronics, LLC
3155 State Street, Blacksburg, VA, 24060-6604
Hubzone Owned:
Y
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
827000014
Principal Investigator:
Jean Marc Rollin
Principal Investigator
(540) 552-4610
jmrollin@nuvotronics.com
Business Contact:
Chris Nichols
Business Official
(540) 552-4610
cnichols@nuvotronics.com
Research Institution:
n/a
Abstract
Typical communication satellites use traditional waveguide front-end architectures due to excellent electrical performance and high reliability. However, these systems are extremely massive and use large volume mostly due to the low-insertion loss waveguide. Replacement of the waveguide components by microfabricated parts without substantially affecting the electrical performance can lead to a breakthrough in wireless communications. The overall goal of the proposed SBIR project is to develop low-cost, reliable, miniaturized RF MEMS switch components suitable for a variety of communication subsystems. Two approaches will be investigated. The first approach will be looking at monolithically integrating RF MEMS switches within the PolyStrataTM technology, developed at Nuvotronics in Blacksburg, VA as part of the DARPA 3DMERFS program. This approach should enable disruptive low-loss and high-Q RF components from S-band up to W-band. The second approach will rely on state of the art known good RF switches to be assembled on the low loss PolyStrata backplane. This second approach will provide lower loss, higher density and higher power handling than the current RF MEMS components. The proposed technology can be applied to multiple operating frequencies at a minimum cost due to the batch capability of the PolyStrata process.

* information listed above is at the time of submission.

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