OPTICOMP NETWORKS, INC.

OptiCOMP is developing a non-abrasive wafering technique that will reduce the cost of manufacturing wide bandgap semiconductor silicon carbide (SiC) and diamond substrates by a factor of two. These ma ...

OptiCOMP has a non-abrasive wafering technique that will reduce the cost of manufacturing wide bandgap semiconductor substrates, i.e. silicon carbide (SiC), gallium nitride (GaN), AlN and diamond by u ...

Wide bandgap materials, such as Gallium Nitride GaN) and Silicon Carbide SiC) are very promising for light-emitting diodes LEDs) and power electronics. These materials are extremely hard and difficult ...

This Small Business Innovation Research Phase I project develops a method of lifting-off an epitaxially grown high-efficiency (>30%) triple-junction III-V solar cell from a Ge or GaAs wafer onto a pol ...

A new method of transferring epitaxially grown active films onto an inexpensive polymeric flexible carrier. Specifically, for making thin lightweight high efficiency (> 30%) IMM3J solar cells while re ...

ABSTRACT: A new method for manufacturing thin, flexible, portable high efficiency III-V PV modules that can be folded and rolled. In particular, IMM3J cells are lifted-off their growth substrate and ...

This SBIR project concerns the fabrication of thin high efficiency multijunction solar cells starting from lattice mismatched GaInP/GaInAs/Ge cells that are grown epitaxially inverted on germanium waf ...