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Data-Converter Integrated Circuit for Proximity Fuze Sensing

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-19-P-0016
Agency Tracking Number: A181-009-1398
Amount: $99,997.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A18-009
Solicitation Number: 18.1
Solicitation Year: 2018
Award Year: 2019
Award Start Date (Proposal Award Date): 2018-11-26
Award End Date (Contract End Date): 2019-05-25
Small Business Information
15985 NW Schendel Avenue Suite 200
Beaverton, OR 97006
United States
DUNS: 124348652
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Charles Myers
 Senior Engineer
 (971) 223-5646
Business Contact
 Debra Ozuna
Phone: (971) 223-5646
Research Institution

In this effort, Voxtel will design and fabricate multiple, highly efficient, digital-to-analog and analog-to-digital data converters integrated into a monolithic integrated circuit (IC) chip. In Phase I, after refining the requirements with U.S. government and other stakeholders, we will conduct a design trade study that includes optimized configurations of the required data-converter blocks. We will use these to develop the preliminary design architectures necessary to incorporate a single analog-to-digital converter (ADC) block, with a dual digital-to-analog (DAC) configuration that is capable of supporting a serial interface to manipulate certain parameters to meet performance specs. After a preliminary design review (PDR), we will design, simulate, validate, and lay out the data-converter IC for fabrication using a domestic 130-nm CMOS IC process. In Phase II, we will test the prototype Integrated Multi-Data-Conversion IC, then design and fabricate a fully functional data-converter IC that: meets operational requirements; interfaces with proximity-fuze sensors and FPGA; can be packaged in a small-package footprint; provides simple interface and communication; and is capable of withstanding harsh environments including but not limited to shock, vibration, and extreme operating and storage temperatures.

* Information listed above is at the time of submission. *

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