Ultra-Strong High-Temperature Bonding of Titanium to Ceramic Materials

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-06-C-7431
Agency Tracking Number: 053-0495
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: MDA05-024
Solicitation Number: 2005.3
Small Business Information
10814 Atwell Drive, Houston, TX, 77096
DUNS: 007189033
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Starikov
 Director of Research
 (713) 748-7926
Business Contact
 David Starikov
Title: Director of Research
Phone: (713) 748-7926
Email: dstarikov@imsensors.com
Research Institution
The objective of this project is development of novel ultra strong high-temperature bonding of titanium (Ti) to ceramic materials, through application of advanced nano- and micro scale Micro-Column Array (MCA) structures fabricated by laser ablation. The proposed manufacturing process will be extended from our recent innovations on the enhancement of bond strength using surface modification of adherent surfaces and modification of adhesive by the introduction of reinforcing components. The combination of these unique features will result in a revolutionary improvement of the bonds between titanium and ceramic materials. In addition to these features the bonding process is relatively inexpensive, environmentally safe, and universal. There are several advantages of the MCA-structured surfaces in contributing to the strength and stability of the brazed joints. Our preliminary results on adhesive bonding indicate that the bond strength increased more than 4 times is dependent on the bonding medium and hence can be extended to bonding of dissimilar materials using brazing alloys. Use of brazing alloys is expected to completely wet Ti side. We also plan to improve the wettability of the brazing alloy with ceramic surface by coating intermediate layers.

* Information listed above is at the time of submission. *

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