Ultra-Strong High-Temperature Bonding of Titanium to Ceramic Materials

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$749,999.00
Award Year:
2007
Program:
SBIR
Phase:
Phase II
Contract:
W9113M-07-C-0168
Award Id:
78464
Agency Tracking Number:
053-0495
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
10814 Atwell Drive, Houston, TX, 77096
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
007189033
Principal Investigator:
David Starikov
Director of Research
(713) 748-7926
dstarikov@imsensors.com
Business Contact:
David Starikov
Director of Research
(713) 748-7926
dstarikov@imsensors.com
Research Institute:
n/a
Abstract
Currently the IRBAS ceramic radomes of the PAC-3 missiles are being attached at the Lockheed Martin Missile & Fire Control Corp (LMMFC) using an adhesive bonding process that is not capable to sustain high mechanical and thermal stresses required for this application. Conventional high-temperature brazing in a furnace cannot be applied due to the large size of the components being bonded and high cost associated with it. A furnaceless bonding process was previously proposed by BAE Systems Emerging Technologies. However this process has not been implemented by LMMFC due to insufficient bond strength resulting from material interface issues. Integrated Micro Sensors Inc. (IMS) proposes an efficient laser-assisted process for fabrication of Micro Column Arrays (MCA) on pre-bonded surfaces, which will allow for significant improvement of the furnaceless brazing process developed at BAE Systems. The objective of this project is to bring the IMS MCA laser ablation process to maturity and demonstrate commercial integration of this process with BAE brazing processes using LMMFC tooling and PAC-3 MSE Radome hardware. As a result of the Phase II project Integrated Micro Sensors Inc. will demonstrate and test a pre-commercial prototype of a PAC-3 missile IRBAS ceramic radome brazed to a Ti alloy attachment ring.

* information listed above is at the time of submission.

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