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EMP AND HPM SUPPRESSION TECHNIQUES

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: N/A
Agency Tracking Number: 32669
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1996
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
6635 South New Haven, Tulsa, OK, 74136
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr. Clinton Dutcher
 (918) 493-3399
Business Contact
Phone: () -
Research Institution
N/A
Abstract
Survival of present day microelectronic circuits depends on their protection from self generated and external electromagnetic interference. This proposal is oriented toward the class of interference generally referred to as overvoltage transients. Means for mitigating these transients include gas discharge tubes, and various solid state devices. Each of these has their own advantages in particular circumstances. In the late 1980's, a new class of metal polymer composites were introduced that hold the potential for replacing all of the above devices in the majority of circumstances at greatly reduced cost and weight and with enhanced flexibility in device and system design. However, it appears that in previous efforts, a dominantly empirical approach was followed, with insufficient understanding of the underlying electrophysical phenomena. A first step toward correcting that situation was taken by Integrated Sciences under the sponsorship of the U. S. Army's Harry Diamond Laboratories, wherein the quantum tunneling aspects of the materials were successfully explored and demonstrated. The object of the present proposal is to complete that effort by an analysis and demonstration of the mechanisms of polymeric avalanche, and the tradeoffs between metallic quantum tunneling, polymeric avalanche, material, morphology, and device geometry.

* Information listed above is at the time of submission. *

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