Ultra-Wideband Through the Wall Imaging Sensor

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$70,000.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
M67854-02-C-1008
Agency Tracking Number:
N01-108-06
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Intelligent Automation, Inc.
7519 Standish Place, Suite 200, Rockville, MD, 20855
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
161911532
Principal Investigator:
Leonard Haynes
President
(301) 222-0444
lhaynes@i-a-i.com
Business Contact:
Marc Toplin
Director of Contracts
(301) 222-0444
mtoplin@i-a-i.com
Research Institution:
n/a
Abstract
"The focus of the work herein proposed will be to exploit what is often called Impulse Radar to implement a through the wall imaging capability. This proposal identifies approaches to significantly improve the performance of current system for through thewall imaging. The key goal is to improve the resolution of the resulting images so that the image will be able to show if a moving person is carrying a weapon, and if so to allow the class of weapon to be identified. This proposal is very specific as tohow this will be achieved. Other improvements over the-state-of-the-art will also be made in range and standoff distance. The basic technology is based on the availability of very low cost ultra-high precision delays. Using these delay circuits, ImpulseRadar systems, which have no carrier frequency, can be built. The only signals transmitted are single impulses, which have very wide bandwidth and can be generated by a single transistor which is either on or off. The advantages of this paradigm includerobustness to multipath, low probability of detection, low power, trivial implementation of true time delay for electronically steerable phased arrays and enhanced SAR imaging capability. Our partner company, Time Domain Corporation (TDC) has invested $100million in private funds to commercialize this technology. A set of custom ASICS have reduced the electronics down to three chips. Our work will be synergistic with TDC's commerci

* information listed above is at the time of submission.

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