Non-Intrusive Method and System for Inspection of Aging Electronic Systems

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8201-05-P-1005
Agency Tracking Number: F051-268-1831
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: AF05-268
Solicitation Number: 2005.1
Small Business Information
15400 Calhoun Drive, Suite 400, Rockville, MD, 20855
DUNS: 161911532
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Eric van Doorn
 Director of Sensor Technology
 (301) 294-5229
Business Contact
 Mark James
Title: Contract & Proposal Manager
Phone: (301) 294-5221
Research Institution
In this proposal, we outline the Terahertz imaging technology to achieve low cost, non-intrusive inspection of electronic boards used in weapon systems. We describe how terahertz imaging is the best probe to detect defects like corrosion and surface failures inside electronic boards compared to other technologies like ultrasound, X-ray, etc. The Terahertz rays penetrates plastic, semiconductor or other non-metallic material while reflects metal. It responds to the chemical changes on metal and is has spectroscopic information i.e. color of the metal can be detected. So, defects like corrosion, rust, surface failures can be detected. The imaging technology also allows detection of mechanical changes that can be associated with phenomenon like electro migration. The radiation poses very few safety risks and sub-millimeter focus resolution is easily achievable. In this proposal, we describe the imaging algorithms that will be used to meet the requirements of the customer. By the end of Phase I, we will have completed investigating these algorithms for the current requirements and demonstrated this technology to detect all the defects of interest. We have also outlined the design of compact terahertz emitters and detectors that will be developed during Phase II to achieve hand held size of the hardware.

* Information listed above is at the time of submission. *

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